NC-559-ASM Soldering Flux Paste fr/CSP Ball Semiconductor Packaging & Repair

Detail:

*This NC-559-ASM Soldering Paste is used for BGA/CSP ball, semiconductor packaging, repair. *No-clean solder paste, little and colorless ,without washing. *Suitable for computer motherboard north and bridge, communications, graphics or other for BGA. *Excellent soldering paste, just use a little each time. *Good for BGA soldering flux paste and machine regardless of manual welding, the success is greatly increased. *Item Condition: Brand New *Color: As Pictures Show *Capacity: 10CC *Model:NC-559-ASM

Package Contents:

1*NC-559-ASM Soldering Paste

Notes: The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.